CHEMCON HI-FLOW ADHESIVE AEROSOL KIT
ChemCon HI-Flow is a very low viscosity instant adhesive designed for bonding most types of substrates. The low viscosity allows rapid penetration between bond lines and consequent rapid curing. Surfaces to be bonded must be clean and dry.
Apply an even layer of instant adhesive, using the applicator tip provided, to the surfaces to be bonded. Though cure is initiated on contact, most bonds will achieve full cure in 24 hours. An application of CCI's Hardener will instantly cure and bond surfaces together.
1lb. Adhesive, 11oz. (CAN) Hardener, 1 Plastic Spreader, 2 Extra Adhesive Caps.
FOLLOW WARNINGS AND DIRECTIONS CAREFULLY
WARNING: This product can expose you to N,Ndimethyl-
p-toluidine, which is known to the State of
California to cause cancer. For more information go to